According to SK Hynix, under the recently agreed upon memorandum of understanding in Taipei, Taiwan, the two semiconductor giants will collaborate to develop sixth-generation HBM4 chips for mass production in 2026.
SK Hynix and TSMC are both major customers of Nvidia, a major player in artificial intelligence
semiconductor market with its graphics processing units, reports Yonhap news agency.
"The collaboration between TSMC, a global leader in the AI memory space, and TSMC, a top global logic foundry, will lead to further innovations in HBM technology," S Hynix said in a statement.
"This collaboration is also expected to achieve breakthroughs in memory performance through tripartite collaboration between product design, foundry and memory provider," it added.
The initial focus of the SK Hynix-TSMC collaboration will be on enhancing the performance of the base die, which is mounted at the very bottom of the HB package, SK Hynix said.HBM chips, integral components used for AI computing, have increasingly attracted attention with the rise of applications such as generative AI, example B models such as ChatGPT.
SK Hynix also said it plans to leverage TSMC's advanced logic process for the base die of the HBM4, strengthening its functionality to meet diverse customer demands for better performance and power efficiency.
The Korean chip maker uses a proprietary technology to make base dies up to the current HBM3E.
In addition, SK hynix and TSMC will also work together to optimize the integration of SK hynix's HBM and TSMC's packaging process, CoWoS technology.
Justin Kim, Head of AI Infra at SK Hynix, said, “We hope that a strong partnership with TSMC will help accelerate our efforts to open collaboration with our customers and develop the industry's best-performing HBM4."
SK Hynix and TSMC are both major customers of Nvidia, a major player in artificial intelligence
semiconductor market with its graphics processing units, reports Yonhap news agency.
"The collaboration between TSMC, a global leader in the AI memory space, and TSMC, a top global logic foundry, will lead to further innovations in HBM technology," S Hynix said in a statement.
"This collaboration is also expected to achieve breakthroughs in memory performance through tripartite collaboration between product design, foundry and memory provider," it added.
The initial focus of the SK Hynix-TSMC collaboration will be on enhancing the performance of the base die, which is mounted at the very bottom of the HB package, SK Hynix said.HBM chips, integral components used for AI computing, have increasingly attracted attention with the rise of applications such as generative AI, example B models such as ChatGPT.
SK Hynix also said it plans to leverage TSMC's advanced logic process for the base die of the HBM4, strengthening its functionality to meet diverse customer demands for better performance and power efficiency.
The Korean chip maker uses a proprietary technology to make base dies up to the current HBM3E.
In addition, SK hynix and TSMC will also work together to optimize the integration of SK hynix's HBM and TSMC's packaging process, CoWoS technology.
Justin Kim, Head of AI Infra at SK Hynix, said, “We hope that a strong partnership with TSMC will help accelerate our efforts to open collaboration with our customers and develop the industry's best-performing HBM4."
