“At a time when many technologies are developing around AI, the key to its implementation lies in high-performance, low-power semiconductors,” Choi Si-young, head of foundry business at Samsung Electronics, said during the annual Samsung Foundry Forum. Is." SFF) in San Jose, California.
“With our proven gate-all-around (GAA) process optimized for AI chips, we plan to introduce integrated, co-packaged optics (CPO) technology for high-speed, low-power data processing, allowing Our customers need AI solutions to propel them forward in this transformative era.”
At this year's SFF, the South Korean tech firm unveiled its foundry business road map, highlighting its technological innovations and vision for the AI era, Yonhap news agency reports.
Samsung AI Solutions is a turnkey AI platform that arose from the collaborative efforts of the company's Foundry, Memory, and Advanced Package (AVP) businesses.Samsung Electronics is uniquely positioned as the only company with all three semiconductor businesses, allowing it to offer customer-tailored solutions in a single deal.
The company said it plans to introduce an all-in-one, CPO-integrated AI solution in 2027, aiming to provide one-stop AI solutions to customers.
Additionally, Samsung Electronics unveiled new foundry process nodes, SF2Z and SF4U, for its latest 2 nanometer and 4nm processes to meet the growing demand for AI chips and compete with world-leading foundry Taiwan Semiconductor Manufacturing Company (TSMC). declare.
SF2Z, the company's latest 2nm process, incorporates optimized backside power delivery network (BSPDN) technology to increase power, performance and area for better high-performance computing designs. Mass production of SF2Z chips is scheduled to begin in 2027.TSMC previously announced plans to implement BSPDN technology in its 1.5nm process by 2026.
Additionally, Samsung Electronics said its SF4U technology for optical shrinkage will be implemented in its 4nm process, with mass production planned by 2025.
Samsung said its preparations for the state-of-the-art 1.4nm process are progressing "smoothly", with performance and yield targets for mass production in 2027.
“With our proven gate-all-around (GAA) process optimized for AI chips, we plan to introduce integrated, co-packaged optics (CPO) technology for high-speed, low-power data processing, allowing Our customers need AI solutions to propel them forward in this transformative era.”
At this year's SFF, the South Korean tech firm unveiled its foundry business road map, highlighting its technological innovations and vision for the AI era, Yonhap news agency reports.
Samsung AI Solutions is a turnkey AI platform that arose from the collaborative efforts of the company's Foundry, Memory, and Advanced Package (AVP) businesses.Samsung Electronics is uniquely positioned as the only company with all three semiconductor businesses, allowing it to offer customer-tailored solutions in a single deal.
The company said it plans to introduce an all-in-one, CPO-integrated AI solution in 2027, aiming to provide one-stop AI solutions to customers.
Additionally, Samsung Electronics unveiled new foundry process nodes, SF2Z and SF4U, for its latest 2 nanometer and 4nm processes to meet the growing demand for AI chips and compete with world-leading foundry Taiwan Semiconductor Manufacturing Company (TSMC). declare.
SF2Z, the company's latest 2nm process, incorporates optimized backside power delivery network (BSPDN) technology to increase power, performance and area for better high-performance computing designs. Mass production of SF2Z chips is scheduled to begin in 2027.TSMC previously announced plans to implement BSPDN technology in its 1.5nm process by 2026.
Additionally, Samsung Electronics said its SF4U technology for optical shrinkage will be implemented in its 4nm process, with mass production planned by 2025.
Samsung said its preparations for the state-of-the-art 1.4nm process are progressing "smoothly", with performance and yield targets for mass production in 2027.
